Handling and Mounting Littelfuse Power Semiconductor Modules with Solid Metal Base Plates

This application note discusses mounting and handling for Littelfuse power semiconductor modules with a backside that is formed by a solid metal base plate.  It includes information  that focuses on special precautions to be considered during mounting.

It is intended for potential adopters of power semiconductors who want to determine the appropriate mounting and cooling solution to ensure proper package mounting and thermal performance.

Applications:
  • Industrial motor drives
  • PV inverters
  • UPS systems
  • DC-DC converters
  • Commercial vehicles

 

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