Application Note: Mounting and Cooling Solutions for SMPD Packages
Mounting and Cooling Solutions for SMPD packages
Designers of motor drives, uninterruptible power supplies, photovoltaic inverters, and DC-DC converters must ensure their power semiconductor junction temperatures are always within device specifications.
This application note offers tips for mounting and cooling of power semiconductors in Surface Mount Power Device (SMPD) Packages, including:
The benefits of the Littelfuse SMPD packaging technology
SMPD layout techniques and considerations for clearance and creepage
Recommendations for the thermal interface material between the SMPD and a heat sink
Methods for mounting an SMPD package with a heat sink on a PC board
A technique for determining the thermal resistance of the SMPD package
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