---
title: "ESBU - App Note: Mounting and Cooling Solutions for SMPD Packages Download"
---

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# Application Note: Mounting and Cooling Solutions for SMPD Packages

#### Mounting and Cooling Solutions for SMPD packages

Designers of motor drives, uninterruptible power supplies, photovoltaic inverters, and DC-DC converters must ensure their power semiconductor junction temperatures are always within device specifications.

![SMPDappnote-LPgraphic](https://info.littelfuse.com/hs-fs/hubfs/SMPDappnote-LPgraphic.jpg?width=595&height=186&name=SMPDappnote-LPgraphic.jpg)

This application note offers tips for mounting and cooling of power semiconductors in Surface Mount Power Device (SMPD) Packages, including:

- The benefits of the Littelfuse SMPD packaging technology
- SMPD layout techniques and considerations for clearance and creepage
- Recommendations for the thermal interface material between the SMPD and a heat sink
- Methods for mounting an SMPD package with a heat sink on a PC board
- A technique for determining the thermal resistance of the SMPD package

 

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