---
title: Bridging the Gap Between Modules and Discretes
---

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Multi-chip, modular devices in discrete-sized packages   
that can be used as power stage building blocks

Ideal for EV charging infrastructure, medical, and industrial applications, our ISOPLUS-SMPD™ and ISOPLUS™ i4-PAC™ package solutions bridge the gap between modules and discretes, providing a range of advantages and value additions:

- Integrated Direct Copper Bonded (DCB) isolation delivers best-in-class reliability under power and temperature cycling via the IXYS proprietary DCB production and discrete assembly with 2.5 kV minimum isolation voltage
- Available in a variety of technologies, such as Si/SiC MOSFET, IGBT, Diode, Thyristor, TRIAC, or a customized combination with different voltage classes: SMPD™ (40 V to 3000 V) and i4-PAC (100 V to 4500 V)
- Offered in several topologies, including single switch, phase leg, H-Bridge, and others
- The SMPD allows fully automated pick and place as well as standard reflow soldering for ease of manufacturing
- Optimized use of DCB space in the component improves the power density and thermal management

**To learn more about how these compact packages leverage various technologies and topologies, complete the form to download the product brief. **

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### Download Product Brief

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